- sputter deposition
- осадження методом розпилювання
English-Ukrainian dictionary of microelectronics. 2013.
sputter deposition
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Sputter deposition — is a physical vapor deposition (PVD) method of depositing thin films by sputtering, that is ejecting, material from a target, that is source, which then deposits onto a substrate, such as a silicon wafer. Resputtering is re emission of the… … Wikipedia
Sputter — Das Sputtern (aus dem englischen to sputter = zerstäuben) – oder auf deutsch, die Kathodenzerstäubung – ist ein physikalischer Vorgang, bei dem Atome aus einem Festkörper (Target) durch Beschuss mit energiereichen Ionen (vorwiegend Edelgasionen)… … Deutsch Wikipedia
Sputter cleaning — is the cleaning of a solid surface in a vacuum by using physical sputtering of the surface. Sputter cleaning is often used in vacuum deposition and ion plating. In 1955 Farnsworth, Schlier, George, and Burger reported using sputter cleaning in an … Wikipedia
Vacuum deposition — Not to be confused with Vacuum coating. Vacuum deposition is a family of processes used to deposit layers atom by atom or molecule by molecule at sub atmospheric pressure (vacuum) on a solid surface. The layers may be as thin as one atom to… … Wikipedia
Physical vapor deposition — (PVD) is a variety of vacuum deposition and is a general term used to describe any of a variety of methods to deposit thin films by the condensation of a vaporized form of the material onto various surfaces (e.g., onto semiconductor wafers). The… … Wikipedia
Pulsed laser deposition — (PLD) is a thin film deposition (specifically a physical vapor deposition, PVD) technique where a high power pulsed laser beam is focused inside a vacuum chamber to strike a target of the desired composition. Material is then vaporized from the… … Wikipedia
Plasma-enhanced chemical vapor deposition — PECVD machine at LAAS technological facility in Toulouse, France. Plasma enhanced chemical vapor deposition (PECVD) is a process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved… … Wikipedia
Ion beam deposition — (IBD) is a process of applying materials to a target through the application of an ion beam.In an ion source source materials gases or evaporated solids are ionized using electron ionization or by application of high electric fields (Penning ion… … Wikipedia
Sputtern — Das Sputtern (aus dem Englischen to sputter = zerstäuben) – oder auf deutsch, die Kathodenzerstäubung – ist ein physikalischer Vorgang, bei dem Atome aus einem Festkörper (Target) durch Beschuss mit energiereichen Ionen (vorwiegend… … Deutsch Wikipedia
High Power Impulse Magnetron Sputtering — (HIPIMS, also known as High Impact Power Magnetron Sputtering and High Power Pulsed Magnetron Sputtering, HPPMS) is a method for physical vapor deposition of thin films which is based on magnetron sputter deposition. HIPIMS utilises extremely… … Wikipedia
Ohmic contact — An ohmic contact is a region on a semiconductor device that has been prepared so that the current voltage (I V) curve of the device is linear and symmetric. If the I V characteristic is non linear and asymmetric, the contact is not ohmic, but is… … Wikipedia
